INTEGRAL-TYPE CERAMIC CIRCUIT BOARD AND METHOD OF PRODUCING SAME

摘要

An electronic-parts-mounting board characterized by comprising a base plate having or not having a recess on one main surface, a ceramic board placed on the main surface of the base plate and smaller than the base plate, and a metal layer so disposed as to cover both the base plate and the ceramic board, wherein the surface that does not touch the base plate of the metal layer and the ceramic board is planar, the base plate is a metal-ceramic composite, and the metal and metal layer in the composite are of different compositions. Thus, an integral-type ceramic circuit board is obtained which is immune to heat cycle and superior in reliability.