发明名称 Conduited heat dissipation device
摘要 A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.
申请公布号 US2002067596(A1) 申请公布日期 2002.06.06
申请号 US20000730629 申请日期 2000.12.05
申请人 SEARLS DAMION T.;LIAN BIN;DUJARI PRATEEK J.;DISHONGH TERRANCE J. 发明人 SEARLS DAMION T.;LIAN BIN;DUJARI PRATEEK J.;DISHONGH TERRANCE J.
分类号 H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/467
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