发明名称 METHOD FOR PLATING ENGINEERING PLASTICS
摘要 PURPOSE: A method for easily and simply electroless plating an engineering plastics to which electroless plating is difficult, a method for manufacturing a primer enabling electroless plating on the engineering plastics, and a method for providing with harmful electromagnetic wave shielding and facing characteristics are provided. CONSTITUTION: The method for plating engineering plastics comprises the steps of forming a primer layer by coating one or more materials selected from the group consisting of ABS(acrylonitrile butadiene styrene) resin and UV(ultraviolet rays) curing paints on the surface of the engineering plastics; and performing dry type plating such as electroless plating or vacuum deposition, sputtering and ion plating on the primer layer, wherein the engineering plastics is polybutylene terephthalate(PBT), polypropylene(PP), polyester(PE), polyamide(PA), acryl, or a mixture thereof, the primer material includes plating ABS resin or nonplating ABS resin, UV curing paints, ABS resin, a mixture thereof including ABS resin, or a mixture of ABS resin and UV curing paints, a plating deposition material is copper, nickel, chromium, gold, silver, tin, lead, zinc or aluminum, the plating layer is a single plating layer of a single material or a composite plating layer in which two or more materials are laid up, the primer layer is formed by spray coating, directing coating, or dipping method, and a forming area of the primer layer is all area or an arbitrary part of the substrate.
申请公布号 KR20020042121(A) 申请公布日期 2002.06.05
申请号 KR20000071886 申请日期 2000.11.30
申请人 LEE, KYUNG HEE 发明人 LEE, KYUNG HEE;LEE, MUN GU;SUNG, WON SEOP
分类号 C23C18/26;(IPC1-7):C23C18/26 主分类号 C23C18/26
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