发明名称 |
CONDUCTIVE LAYER FILLED TRENCH ISOLATION SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF |
摘要 |
PURPOSE: A conductive layer filled trench isolation semiconductor device and a formation method thereof are provided to improve an operating speed and the efficiency by reducing an inverse narrow width effect. CONSTITUTION: A trench isolation semiconductor device comprises an upper part having a silicon nitride(33) and a silicon oxide(35), a side part made of a silicon nitride oxidation layer(20), and a conductive layer(31) made of a dopant doped polysilicon connected to a substrate(10) at the bottom part of the conductive layer(31) and surrounded with the silicon nitride(33) and the silicon nitride oxidation layer(20). At this time, active regions(13) having a source and a drain region are completely isolated by connecting the conductive layer(31) and the substrate(10), thereby preventing an inverse narrow width effect, so that the property can be improved.
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申请公布号 |
KR20020042275(A) |
申请公布日期 |
2002.06.05 |
申请号 |
KR20000072091 |
申请日期 |
2000.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JAE GYU;LEE, SANG HYEON |
分类号 |
H01L21/76;H01L21/74;H01L21/762;H01L21/763;H01L21/8242;H01L27/108;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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