Semiconductor package

摘要

In a semiconductor package comprising a heat spreader (33), a heat sink (75), a wiring board (66), and a connector, a heat spreader (33) mounted on a remaining region of the upper surface of a substrate (38). The heat sink (75) is thermally connected to a primary integrated circuit chip through the heat spreader (33) and to a secondary integrated circuit chip (23). The heat sink (75) has electrical conductivity. The heat sink comprises a base plate and at least one connecting member which perpendicularly extends from the base plate. A wiring board (66) has a plurality of contact holes and a plurality of contact slits. A connector is mounted on the wiring board. The connector has a plurality of contacts. The contacts comprises a plurality of socket portions and a plurality of terminal portions. The contacts are connected to an input/output pins with the input/output pins inserted into the respective socket portions. The terminal portions are inserted into the respective contact holes. The connector has at least one ground contact. The ground contact comprises a ground socket portion and a ground terminal portion. The at least one ground contact is electrically connected to the at least one connecting member with the connecting member inserted into the ground socket portion. The ground terminal portions are inserted into the contact slits. <IMAGE>