ABRASIVE CONSTRUCTION FOR SEMICONDUCTOR WAFER MODIFICATION
摘要
<p>An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.</p>
申请公布号
EP0921906(B1)
申请公布日期
2002.06.05
申请号
EP19970936207
申请日期
1997.08.06
申请人
MINNESOTA MINING AND MANUFACTURING COMPANY;EXCLUSIVE DESIGN COMPANY, INC.