| 摘要 |
A method for forming by molding a plastic protective package (9) for an electronic integrated circuit comprising an electronic device (30, 30a) activated from the outside of said protective package (9), comprising the following steps: dispensing a covering layer (50) of elastic material on a portion of said electronic device (30, 30a); shaping said covering layer (50) to form a projecting portion (51) from a surface of said electronic device (30, 30a); molding said electronic integrated circuit in said plastic protective package (9) using a mold including at least a half-mold abutting against said projecting portion (51); obtaining a hole (70) or a window formed in alignment with said projecting portion (51) in said protective package. <IMAGE> |
