| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermally conductive film having excellent thermal conductivity and excellent adhesion to a substrate, to obtain a liquid for forming the film and the substrate provided with the film and to provide a method for producing the substrate provided with the film a heat radiating plate and a heat radiating structure using the film. SOLUTION: This thermally conductive film is formed from a liquid for forming the thermally conductive film comprising thermally conductive fine particles and an emulsion of electrodepositing particles comprising at least either one of a polymerizable compound and a polymer on the surface of the substrate by electrodeposition, or is obtained by further heat-treating the resultant film. The substrate provided with the thermally conductive film is produced by electrodepositing the liquid for forming the thermally conductive film onto the surface of the substrate according to an electrodeposition method and forming the thermally conductive film or further heat-treating the resultant film. The electrodepositing particles preferably have electric charges on the particle surfaces and are preferably one or more kinds of polymers of polyimide-based, epoxy-based, acrylic-based, polyester-based, fluorine- based and silicone-based polymers. The thermally conductive fine particles are preferably boron nitride, aluminum nitride, silicon carbide, etc. The heat radiating structure is prepared by joining a heat radiating plate having the thermally conductive film to a heating element through the thermally conductive film formed on the surface of the heat radiating plate. |
