GRINDING DEVICE AND GRINDING METHOD FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a grinding method and a grinding device and therefor for finishing a substrate made by slicing a silicon ingot to have a plane surface without undulation on the surface. SOLUTION: An adhesive chuck 51 is a laminated structure constituted by a rigid body adhesive plate 51a, a soft rubber film 51b having a thickness of 1 to 5 mm, and a soft rubber film wherein a hole 58 having a diameter of 0.5 to 2 mm is penetrated. The substrate obtained by slicing the ingot is adhered to the soft rubber film 51b of the adhesive chuck 51. A grinding wheel rotatably held by a spindle is pressed from an upper surface side of the substrate, and the adhesive chuck 51 and the grinding wheel 41 are slid to grind the surface of the substrate.