| 摘要 |
A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape. In the application of the present invention to the bonding of conductive leads on a TAB circuit to the silicon substrate of an inkjet printhead the need for a window in the TAB circuits is eliminated. The elimination of the window results in elimination of the need for an encapsulation material to cover the conductive leads in the TAB circuit. This in turn results in die size reduction, or increased number of nozzles with the same die size, ease of assembly, higher yields, improved reliability, ease of nozzle serviceability, and overall material and manufacturing cost reduction.
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