发明名称 |
Semiconductor flip-chip package and method for the fabrication thereof |
摘要 |
A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/° C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/° C.
|
申请公布号 |
US6399426(B1) |
申请公布日期 |
2002.06.04 |
申请号 |
US20010948921 |
申请日期 |
2001.09.07 |
申请人 |
CAPOTE MIGUEL ALBERT |
发明人 |
CAPOTE MIGUEL ALBERT;ZHU XIAOQI;BURRESS ROBERT VINSON;LEE YONG-JOON |
分类号 |
H01L21/56;H01L23/498;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|