| 发明名称 |
Method of providing a vertical interconnect between thin film microelectronic devices |
| 摘要 |
A simple and reliable method of providing a vertical interconnect between thin-film microelectronic devices is provided. In said method, a tool tip is used to make a notch in a vertical interconnect area of two organic electrically conducting areas separated from each other by an organic electrically insulating area. The method is used in the manufacture of integrated circuits consisting substantially of organic materials. |
| 申请公布号 |
US6400024(B1) |
申请公布日期 |
2002.06.04 |
| 申请号 |
US19980135193 |
申请日期 |
1998.08.17 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
DRURY CHRISTOPHER J.;MUTSAERS CORNELIUS M. J.;HART CORNELIS M.;DE LEEUW DAGOBERT M. |
| 分类号 |
H01L21/3205;H01L21/48;H01L21/768;H01L23/498;H01L23/52;H01L23/532;H01L23/535;H01L51/00;(IPC1-7):H01L29/40 |
主分类号 |
H01L21/3205 |
| 代理机构 |
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