发明名称 THERMOSETTING ELECTROCONDUCTIVE PASTE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting electroconductive paste composition which can realize a high electric conductivity and a good adhesion. SOLUTION: A flaky silver powder and a spherical silver powder are blended as a silver powder in the composition, a blocked polyisocyanate compound, an epoxy resin and a curing agent are blended as a thermosetting component, furthermore, a solvent is blended.
申请公布号 JP2002161123(A) 申请公布日期 2002.06.04
申请号 JP20000357421 申请日期 2000.11.24
申请人 KYOTO ELEX KK 发明人 MORISHIMA NOBUAKI;NAKAI TAKAMITSU;SUEHIRO MASATOSHI
分类号 C08K3/08;C08G18/58;C08L75/04;H01B1/22;(IPC1-7):C08G18/58 主分类号 C08K3/08
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