| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving an adhesion between a metal thin film formed on a substrate and a metal film electroplated later thereon, even when the metal thin film is very thin. SOLUTION: The method for improving the adhesion between the metal thin film of a conducting layer and the electroplated film, comprises immersing the substrate provided with the metal thin film of the conducting layer, into a liquid of pH 2 or lower, which includes a predetermined concentration of a coupling agent having metal scavenging ability, before electroplating metal.
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