Radiating plate structure and method for manufacturing semiconductor devices using the same structure

摘要

A thermosetting epoxy adhesive 9 is applied at the end portion of one surface of the radiating plate 8 onto which a protection ring is bonded, and a protection tape 13 provided with projections 13a is pasted with the thermosetting epoxy adhesive 9 so that projections 13a may project to the opposite side of the radiating plate 8, to constitute the radiating plate structure 20 as one piece. And the radiating plate structures 20 are stacked within the magazine of the radiating plate mounting machine, each radiating plate structure 20 being picked up by the radiating plate mounting machine, its protection tape being peeled, the radiating plate 8 being mounted at a predetermined position.