| 摘要 |
A support structure for the mounting of laser diode arrays, to facilitate the pumping of a suitably-shaped lasing medium, is constituted by a non-planar, preferably generally annularly-shaped, thermally conductive portion having an outer surface and an inner surface, the inner surface being shaped to accommodate an appropriate number of laser diode arrays to pump the medium. The outer surface may have cooling fins provided on the outside to facilitate the removal of heat from the vicinity of the laser diode arrays. Axial or circumferential cooling passages may be provided to facilitate removal of heat from the vicinity of the lasing medium, as well as the arrays. The lasing medium also may be surrounded by a cooling tube through which coolant flows, to facilitate removal of heat from the vicinity of the lasing medium in particular. A plurality of such support structures may be provided to accommodate higher power requirements, and also to enable greater distribution of laser light around and along the lasing medium, for more uniform pumping and/or power distribution. A method of fabricating the support structure, and a resulting diode laser pump apparatus also are disclosed.
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