| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing electronic parts wherein minute ceramic debris is not generated inside, and the electronic parts to be stored inside can be always made to normally function. SOLUTION: Punching is applied to a ceramic green sheet 13. A solvent 14 for dissolving the ceramic green sheet 13 is applied to a punching surface B of the ceramic green sheet 13 to smooth the punching surface by dissolving, and then the ceramic green sheet is fired. |
