METHOD FOR REDUCING MOISTURE OF PREPREG, PREPREG AND PRINT WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for reducing moisture of a prepreg which can reduce enough the moisture of multiple prepreg sheets in a short time while regulating a fluctuation of a curing time of a resin contained in the prepreg. SOLUTION: The moisture of the prepreg prepared by impregnating the resin into a substrate and making it semi-cured is reduced by the method. The prepreg is retained at 36-50 deg.C and also in a depressurized state below an atmospheric pressure.