Cleaning composition for removing adhesives

摘要

A cleaning composition is presented for removing an adhesive from hard substrates. The cleaning solution contains 25 to 98 percent by weight of water, 5 to 74 percent by weight of a chaotropic agent, and 0.001 to 10 percent by weight of at least one surfactant. The cleaning composition is especially effective in removing aqueous-based resin adhesives from machine parts.