发明名称 SINTERED SPUTTERING TARGET MATERIAL FOR FORMING PROTECTIVE LAYER OF LIGHT MEDIA, SHOWING SUPERIOR FRACTURE RESISTANCE UNDER HIGH-POWER SPUTTERING CONDITION
摘要 PROBLEM TO BE SOLVED: To provide a target material for forming a protective layer of light media, which shows a superior fracture resistance even when a high power condition for sputtering is employed in order to form the layer at high speed. SOLUTION: The target material for forming the protective layer of light media comprises a compact sintered with hot press consisting of mixed powder having a composition of 4-30% silicon oxide, 7-35% indium oxide, 1-5% titanium oxide, and zinc sulfide as a remainder, by mass%, and a structure in which a mixed phase of substantial indium oxide and titanium oxide composes a continuous reticulated phase, and a zinc sulfide phase and a silicon oxide phase bury the rest of the above reticulated continuous phase as a dispersed phase each, when the structure is observed with a scanning electron microscope.
申请公布号 JP2002161357(A) 申请公布日期 2002.06.04
申请号 JP20000353805 申请日期 2000.11.21
申请人 MITSUBISHI MATERIALS CORP 发明人 MISHIMA TERUSHI;WATANABE KAZUO;MORI RIE
分类号 C04B35/00;C04B35/547;C23C14/34;G11B7/254;G11B7/257;G11B7/26 主分类号 C04B35/00
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