FLAME-RETARDANT HEAT-RESISTANT RESIN COMPOSITION, ADHESIVE FILM USING THE SAME AND POLYIMIDE FILM WITH ADHESIVE

摘要

PROBLEM TO BE SOLVED: To obtain a flame-retardant heat-resistant resin composition having an excellent thermal stress reducing effect useful for an adhesive for various printed-circuit boards and an adhesive film, to obtain an adhesive film and a polyimide film with an adhesive using the same. SOLUTION: This flame-retardant heat-resistant resin composition comprises (A) a modified polyamide-imide resin having a microphase separation structure, (B) a thermosetting resin and (C) an organophosphorus compound.