发明名称 COVER TAPE AND PACKAGE BODY FOR EMBOSSED CARRIER
摘要 PROBLEM TO BE SOLVED: To provide a cover tape for an embossed carrier and a package body therewith which can be used without being affected by materials of the embossed carrier in housing electronic components, and also which can stabilize the quality of the components and improve operating efficiency in taking out the components by a fitting machine. SOLUTION: On one side surface of a substrate film 2 an antistatic resin layer 1 is laminated, and on the other side surface a conductive layer 3 and an adhesive material layer 4 are successively laminated.
申请公布号 JP2002160763(A) 申请公布日期 2002.06.04
申请号 JP20000357195 申请日期 2000.11.24
申请人 TOPPAN PRINTING CO LTD 发明人 YAMAMOTO WATARU;KURODA KENJIRO;OYA MASAHITO
分类号 B65D73/02;B65D85/86;(IPC1-7):B65D73/02 主分类号 B65D73/02
代理机构 代理人
主权项
地址