发明名称 Semiconductor integrated circuit wiring condition processing method
摘要 In a wiring condition processing method for a semiconductor integrated circuit layout information, which determines the layout of devices on the semiconductor circuit, is created based on logic information describing a connection relationship among the devices on the semiconductor. Next, a virtual wiring path is determined from the layout information. Based on the virtual wiring path, a wiring delay value is calculated. If the wiring delay value exceeds a predetermined reference value, one or more of information on the usage ratio of a wide wiring line, information on the usage ratio of a wiring layer with a small wiring load capacity, information on the usage ratio of a parallel wiring line, and information on the usage ratio of a wiring material are added to the information on the virtual wiring path to create wiring condition information.
申请公布号 US6401233(B1) 申请公布日期 2002.06.04
申请号 US19990405082 申请日期 1999.09.27
申请人 HITACHI, LTD. 发明人 SUZUKI KATSUYOSHI;MOGAKI MASATO;HONGYO KATSUAKI
分类号 H01L21/82;G06F17/50;(IPC1-7):G06F17/50 主分类号 H01L21/82
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