发明名称 SUBSTRATE PROCESSING LIQUID SUPPLY MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing liquid supply mechanism, in which liquid leakage at the time of stopping the supply of a processing liquid is surely prevented by reducing a time required to dry a substrate. SOLUTION: At the time of stopping the discharge of the processing liquid from a state in which the processing liquid is discharged from a nozzle 3, discharge values 7 and 8 in the opened state are closed successively in the order from the 2nd discharge valve 8 to the 1st discharge valve 7 by a controller 9. Concretely, the controller 9 outputs a closing signal to the 1st discharge valve 7 after a prescribed time (e.g. after 1-2.0 sec) elapses from a time when the closing signal is outputted to the 2nd discharge valve 8. As a result, the stream of the processing liquid in a processing liquid supply pipe 5 is cut-off to stop the discharge of the processing liquid from the nozzle 3.
申请公布号 JP2002159906(A) 申请公布日期 2002.06.04
申请号 JP20000360729 申请日期 2000.11.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 TSUCHIYA AKIO
分类号 G03F7/30;B05C11/10;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):B05C11/10 主分类号 G03F7/30
代理机构 代理人
主权项
地址