| 发明名称 |
Insulative matrix material |
| 摘要 |
The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.
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| 申请公布号 |
US6399666(B1) |
申请公布日期 |
2002.06.04 |
| 申请号 |
US19990238357 |
申请日期 |
1999.01.27 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HAWKER CRAIG JON;HEDRICK JAMES LUPTON;HEISE ANDREAS;MECERREYES DAVID;MILLER ROBERT DENNIS;TROLLSAAS OLOF MIKAEL |
| 分类号 |
H01L21/312;H01L21/316;H01L21/768;H01L23/532;(IPC1-7):C08J9/00 |
主分类号 |
H01L21/312 |
| 代理机构 |
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