STRUCTURE OF MULTI-LAYERED MODULE IN PCB

摘要

PURPOSE: A structure of a multi-layered module in a PCB(Printed Circuit Board) is provided to shorten a manufacturing process and reduce a manufacturing cost by designing the multi-layered module. CONSTITUTION: A plurality of components are arranged on the first layer(110). The second layer(120) as a ground copper layer is formed on a lower portion of the first layer(110). The third layer(130) as a signal layer is formed on a lower portion of the second layer(120). The fourth layer(140) as a Vdd power layer is formed on a lower portion of the third layer(130) in order to be matched with impedance of the third layer(130). The fifth layer(150) as a signal layer is formed on a lower portion of the fourth layer(140). The sixth layer(160) is formed on a lower portion of the fifth layer(150). The sixth layer(160) has a pad connected with a solder ball of the first layer(110) and a copper layer corresponding to a pattern of the fifth layer.