发明名称 INJECTION MOLDING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a simple injection molding method capable of spreading a material to every corner even when the material is rapidly packed by injection and thereby, obtain moldings of high quality, and an injection molding device. SOLUTION: An intramold pressure as a setting pressure for a control starting set pressure(SSP) is made to arrive at a first target pressure (SP1) in a pressure boosting time (ST1) set by a setting timer for the pressure boosting time, and the first target pressure (SP1) is maintained for a hold time for a first target pressure hold time (HT1) set by a setting timer for the first target pressure hold time. Then the intramold pressure is made to reach a second target pressure (SP2) along a pressure boosting curve set by a pressure boosting pattern setter. Next, an injection screw for injecting a molten resin is controlled so that the second target pressure (SP2) is maintained for a hold time for the second target pressure (HT2) set by a setting timer for the second target pressure hold time.
申请公布号 JP2002160277(A) 申请公布日期 2002.06.04
申请号 JP20000358056 申请日期 2000.11.24
申请人 MITSUBISHI HEAVY IND LTD;TOYOTA MOTOR CORP 发明人 KUBOTA KOJI;WAKAI SATORU;SHINOHARA KENICHIRO
分类号 B29C45/77;B29C45/47;(IPC1-7):B29C45/77 主分类号 B29C45/77
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