| 摘要 |
A semiconductor device allowing a finer terminal pitch, a low profile, and easy product inspection is disclosed. A semiconductor device includes a semiconductor chip and a film substrate having the semiconductor chip connected thereon. The film substrate includes an insulating film having a plurality of openings formed in a desired pattern and a wiring layer formed in a chip-connecting surface of the insulating film. Solder balls are each directly bonded to the external connection pads through the openings. The wiring layer includes substrate pads each being connected to the chip pads of the semiconductor chip, and external connection pads each being electrically connected to these substrate pads. The external connection pads are each formed over the openings so that the openings are covered with the external connection pads on the chip-connecting surface of the insulating film, respectively.
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