发明名称 |
Interference mitigation through conductive thermoplastic composite materials |
摘要 |
An electromagnetic radiation interference mitigation shield is provided for an electronic circuit component. The shield includes a body formed from an electrically and thermally conductive composite material characterized by a volume resistivity ranging from about 0.1 to about 1,000 ohm-cm and a thermal conductivity ranging from about 10x10<-4>-cal.-cm./sec.-cm.<2>-° C. to about 30x10<-4>-cal.-cm./sec.-cm.<2>-° C. |
申请公布号 |
AU3045302(A) |
申请公布日期 |
2002.06.03 |
申请号 |
AU20020030453 |
申请日期 |
2001.11.20 |
申请人 |
OWENS CORNING |
发明人 |
P. ROSS LICHTENSTEIN;HONG PENG |
分类号 |
H01L23/373;H01L23/552;H05K9/00 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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