发明名称 |
SYSTEM AND METHOD FOR HEAT MANAGEMENT IN ELECTRONIC ENCLOSURE |
摘要 |
PURPOSE: A system and method for heat management in an electronic enclosure is provided to offer a heat management system to control heat in the electronic enclosure of a BTS(Base station Transceiver Subsystem). CONSTITUTION: A heat exchange plate(250) is connected to an LPA(Low Power Amplifier)(245) mechanically and thermally. A low-temperature liquid(255) is circulated through the heat exchange plate(250), and heat is transferred to the low-temperature liquid(255) through the heat exchange plate(250) from the LPA(245). A high-temperature liquid(260) having the heat received from the heat exchange plate(250) is discharged, and it is circulated through a liquid-air heat exchanger(263) in an external loop exhaust vent(265). |
申请公布号 |
KR20020041734(A) |
申请公布日期 |
2002.06.03 |
申请号 |
KR20010036245 |
申请日期 |
2001.06.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN JAKE J |
分类号 |
H04B7/15;F28D21/00;H05K7/20 |
主分类号 |
H04B7/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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