发明名称 SYSTEM AND METHOD FOR HEAT MANAGEMENT IN ELECTRONIC ENCLOSURE
摘要 PURPOSE: A system and method for heat management in an electronic enclosure is provided to offer a heat management system to control heat in the electronic enclosure of a BTS(Base station Transceiver Subsystem). CONSTITUTION: A heat exchange plate(250) is connected to an LPA(Low Power Amplifier)(245) mechanically and thermally. A low-temperature liquid(255) is circulated through the heat exchange plate(250), and heat is transferred to the low-temperature liquid(255) through the heat exchange plate(250) from the LPA(245). A high-temperature liquid(260) having the heat received from the heat exchange plate(250) is discharged, and it is circulated through a liquid-air heat exchanger(263) in an external loop exhaust vent(265).
申请公布号 KR20020041734(A) 申请公布日期 2002.06.03
申请号 KR20010036245 申请日期 2001.06.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAN JAKE J
分类号 H04B7/15;F28D21/00;H05K7/20 主分类号 H04B7/15
代理机构 代理人
主权项
地址