| 摘要 |
A method comprises the steps of heating chucked waste printed board to separate and collect solder from the waste printed-board, blowing the printed board to separate and collect surface-mounted components from the printed board, vibrating the printed board to separate and collect through-connection mounted components from the printed board, scrubbing the surface of the printed board to separate and collect residual mounted components, and collecting the printed board from which the mounted components have been separated. As a consequence, it is possible to reuse the collected printed board and a part of the collected components. Since no chemical treatment is performed, there is no fear of generating secondary pollution. Besides, substances that are not recyclable after the processing is hardly produced. Since the steps can be executed continuously within a short time, the process efficiency is extremely excellent. |
