SUBSTRATE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: To provide a substrate for a semiconductor device that is easy to transfer, and to provide a method of manufacturing the semiconductor device. CONSTITUTION: This method of manufacturing a semiconductor device contains a step of forming solder resist 5 on the substrate 1 for mounting semiconductor elements, wherein the solder resist 5 has a linear expansion coefficient A, that is different from that of the substrate 1, and the substrate 1 has a long side 1a and a short side 1b and contains organic substances; a step of giving a bend along the short side 1b to the substrate 1 on which the solder resist 5 has been formed; and a step of transferring the substrate 1 to which bend has been given.