LEAD FRAME HAVING DUMMY LEAD FOR PREVENTING PACKAGE CRACK AND SEMICONDUCTOR CHIP PACKAGE USING THE SAME

摘要

PURPOSE: A lead frame having dummy lead for preventing package crack and a semiconductor chip package using the lead frame are provided to prevent package crack due to adhesive strength between a package body and a molding die when the package body is detached from the molding die after a molding process. CONSTITUTION: The lead frame(120) includes a pair of parallel guide rails(126), a pair of dam bars(125) connected perpendicularly to the guide rails(126), a die pad(121) on which a semiconductor device(110) is attached, and inner leads(123) arranged toward both sides of the die pad(121) and electrically connected to the device(110). In particular, the lead frame(120) further includes at least one dummy lead(170) which is protruded from the guide rails(126) and located near the dam bars(125). That is, the dummy lead(170) is formed at a side of the package body(150), the side having no inner lead. The package body(150) is therefore strongly joined to the dummy lead(170), so that crack of the package body(150) can be prevented at the side.