| 摘要 |
A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together. The first and second housing members are secured by a plurality of latches (20), each with a hook (22) secured to the first housing member which passes through a hole (40) in the second housing member and is releasably secured within the hole by the hook. In accordance with a second embodiment of the invention, the latches and holes of the first embodiment are replaced with a plurality of rotatable latch members (64) which are secured to the first housing member and are rotatable about a hinge (70), each latch member (64) having a hook (66) at the distal end thereof for engagement with a hole 68 in the second housing member. One of the walls 16 of the first embodiment is removed and replaced with a liner of a very soft rubber or foam or the like (62), preferably of an antistatic variety, which will absorb shock applied to the housing.
|
