| 摘要 |
In the case of molded electronic components a mold material ridge remains in the housing on the separation plane of the mold tool. This is particularly disadvantageous if the ridge leads through a side surface area located opposite to the connection pins, serving as a docking surface for a suction needle. A molded electronic component with numerous connection pins protruding on a single plane from a side surface area of an essentially cuboid housing, and a circumferential ridge along the other side area surfaces on the plane of the connection pins, the thickness of which ridge essentially corresponds to the thickness of the connection pins wherein on the side surface area located opposite to the side surface area of the connection pins, in the plane of the connection pins, the ridge-within a connected part of the side surface area-passes into a groove such that the component can be better placed by a tool onto a printed circuit board. The invention is particularly suitable for the production of molded electronic components whose separation plane runs through that housing surface which serves as docking surface for a suction needle.
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