发明名称 |
Thermally conductive electronic device case |
摘要 |
A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.
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申请公布号 |
US2002064024(A1) |
申请公布日期 |
2002.05.30 |
申请号 |
US20000726141 |
申请日期 |
2000.11.29 |
申请人 |
MCCULLOUGH KEVIN A.;SAGAL E. MIKHAIL;MILLER JAMES D. |
发明人 |
MCCULLOUGH KEVIN A.;SAGAL E. MIKHAIL;MILLER JAMES D. |
分类号 |
G06F1/20;H01L23/367;H01L23/373;H01L23/552;H05K7/20;H05K9/00;(IPC1-7):H05K5/00 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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