METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH A PIEZOELECTRIC OR PYROELECTRIC LAYER

摘要

At least one bottom electrode (U), a piezoelectric or pyroelectric layer (S) over said bottom electrode and a top electrode (O) over said layer are produced as parts of the layer sequence. The bottom electrode (U) is produced by depositing a conductive material and then chemically-mechanically polished in order to smooth out surface roughness. The thickness of the deposited conductive material is preferably reduced by 10 nm to 100 nm by the chemical-mechanical polishing process.