发明名称 Joining material for electronic components, electronic components and a method for manufacturing the same
摘要 A joining material for an electronic component was disclosed. The component has a plurality of functional layers, each selected from a magnetic layer and dielectric layer and joined with each other. The joining material comprising a glass and a composition of a mol % of ZnO, b mol % of BaO and c mol % of TiO2 (a=12-45, b=4-45, c=18-81, a+b+c=100), wherein 0.1 to 10 weight parts of the glass is added to 100 weight parts of the composition.
申请公布号 US2002064669(A1) 申请公布日期 2002.05.30
申请号 US20010001677 申请日期 2001.10.31
申请人 NGK INSULATORS, LTD. 发明人 OOBUCHI TAKESHI;KODA YASUNORI
分类号 C03C8/04;C03C8/14;C03C8/24;C04B37/00;C09J1/00;H01G4/30;H01G4/40;(IPC1-7):B32B9/00;B32B18/00 主分类号 C03C8/04
代理机构 代理人
主权项
地址