SLURRY FOR CHEMICAL-MECHANICAL POLISHING

摘要

PURPOSE: To provide slurry for chemical-mechanical polishing, that inhibits generation of dishing, and at the same time, achieves polishing at a high polishing speed in chemical-mechanical polishing in a metal film formed on an insulating film having a recess on a substrate. CONSTITUTION: A thickening agent, set to at least 0.001 and less than 0.05 percentage by mass with respect to the entire slurry. In this case, the thickening agent does not have an ionic group, having a sign opposite to that of a charge on the surface of a polishing material particle. Viscosity in the slurry is adjusted to at least 1 mPa.s and less than 5 mPa.s.