发明名称 Unified conveying apparatus, and semiconductor device manufacturing facility comprising the same
摘要 A conveying apparatus conveys articles used for manufacturing semiconductor devices. The conveying apparatus has a conveying rail section that includes a first rail providing a first conveying route, a second rail providing a second conveying route, and an intermediate rail structure interconnecting the first and second rails. Respective vehicles are fitted to the first and second rails so as to convey articles as supported atop the first rail or as suspended from the second rail, respectively. The conveying apparatus can be readily installed in the bay of an automatic manufacturing system, e.g., of a type for processing wafers having a diameter of 300 mm. In this case, the conveying route of the articles is unified, and space is saved, as well.
申请公布号 US2002064442(A1) 申请公布日期 2002.05.30
申请号 US20010995875 申请日期 2001.11.29
申请人 AHN SEUNG-HOON;PARK SEOK-HEE 发明人 AHN SEUNG-HOON;PARK SEOK-HEE
分类号 B61B13/06;B61B13/08;B61D27/00;B65G49/07;B65G54/02;H01L21/677;H01L21/68;(IPC1-7):B65G67/00 主分类号 B61B13/06
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