发明名称 Heat-sensitive adhesive material, method of preparing same and method of using same
摘要 A heat-sensitive adhesive material including a substrate and a heat-sensitive adhesive layer provided thereon. The adhesive layer has one of the following properties (a) and (b): (a) the heat-sensitive adhesive layer, when thermally activated, exhibits an adhesive strength in the range of 1800-3500 gf/40 mm at 0-10° C.; (b) the heat-sensitive adhesive layer, when thermally activated, exhibits a scratch resistance in the range of 150-500 gf at 0° C.
申请公布号 US2002064613(A1) 申请公布日期 2002.05.30
申请号 US20010962495 申请日期 2001.09.25
申请人 RICOH COMPANY, LTD. 发明人 KUGO TOMOYUKI;IKEDA TOSHIAKI
分类号 C09J7/02;C09J11/00;C09J11/04;C09J11/06;C09J11/08;(IPC1-7):B32B1/02;B65D1/00;B32B1/08;B29D22/00;B29D23/00;B32B7/12;B32B15/04 主分类号 C09J7/02
代理机构 代理人
主权项
地址