发明名称 |
Heat-sensitive adhesive material, method of preparing same and method of using same |
摘要 |
A heat-sensitive adhesive material including a substrate and a heat-sensitive adhesive layer provided thereon. The adhesive layer has one of the following properties (a) and (b): (a) the heat-sensitive adhesive layer, when thermally activated, exhibits an adhesive strength in the range of 1800-3500 gf/40 mm at 0-10° C.; (b) the heat-sensitive adhesive layer, when thermally activated, exhibits a scratch resistance in the range of 150-500 gf at 0° C.
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申请公布号 |
US2002064613(A1) |
申请公布日期 |
2002.05.30 |
申请号 |
US20010962495 |
申请日期 |
2001.09.25 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
KUGO TOMOYUKI;IKEDA TOSHIAKI |
分类号 |
C09J7/02;C09J11/00;C09J11/04;C09J11/06;C09J11/08;(IPC1-7):B32B1/02;B65D1/00;B32B1/08;B29D22/00;B29D23/00;B32B7/12;B32B15/04 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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