Ball grid array (BGA) mounting device

摘要

An improved ball grid array assembly is disclosed. The assembly includes a ball grid array package (100), a substrate (104), and an insert device (108) interposed therebetween. Insert device (108) includes an array of contacts configured to couple to package (110) and an array of solder balls (112) configured to couple to a printed circuit board (116). Insert device (108) reduces stresses in the assembly caused by any mismatch of the thermal coefficients of expansion of BGA package (100) and printed circuit board (116).