发明名称 Dual process semiconductor heterostructures
摘要 A method for forming an epitaxial layer involves depositing a buffer layer on a substrate by a first deposition process, followed by deposition of an epitaxial layer by a second deposition process. By using such a dual process, the first and second deposition processes can be optimized, with respect to performance, growth rate, and cost, for different materials of each layer. A semiconductor heterostructure prepared by a dual deposition process includes a buffer layer formed on a substrate by MOCVD, and an epitaxial layer formed on the buffer layer, the epitaxial layer deposited by hydride vapor-phase deposition.
申请公布号 US2002064675(A1) 申请公布日期 2002.05.30
申请号 US20010023910 申请日期 2001.12.18
申请人 SOLOMON GLENN S.;MILLER DAVID J.;UEDA TETSUZO 发明人 SOLOMON GLENN S.;MILLER DAVID J.;UEDA TETSUZO
分类号 C30B29/38;H01L21/205;H01L33/00;(IPC1-7):C25D5/10;B32B15/00;H01L29/12;B32B15/04;H01L21/44 主分类号 C30B29/38
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