发明名称 Non-cyanide-type gold-tin alloy plating bath
摘要 The present invention provides a non-cyanide-type gold-tin alloy plating bath comprising : (i) at least one water-soluble gold compound, (ii) at least one completing agent for gold, (iii) at least one water-soluble tin compound, and (iv) at least one component selected from the group consisting of cationic macromolecular surfactants and cationic macromolecular compounds. By using the non- cyanide-type gold-tin alloy plating bath of the present invention, a gold-tin alloy plating film having good brightness, reflow properties and the like can be formed.
申请公布号 US2002063063(A1) 申请公布日期 2002.05.30
申请号 US20010971810 申请日期 2001.10.09
申请人 ISHIHARA CHEMICAL CO., LTD. 发明人 UCHIDA EI;OKADA TAKASHI
分类号 C25D3/56;C25D3/60;C25D3/62;C25D7/00;(IPC1-7):C25D3/62 主分类号 C25D3/56
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