发明名称 |
Surface mounting device and method thereof |
摘要 |
A surface mounting device comprising: multiple transfers being moved in the X and Y axis directions by an X-Y gantry installed on a base frame and supplying a printed circuit board(PCB) for mounting parts or loading the discharged PCB by a head unit for sucking parts supplied from a parts supply unit and mounting the sucked parts on the PCB and multiple conveyers installed to be moved horizontally in a predetermined direction at a predetermined position on the base frame for carrying the PCB supplied from the multiple transfers to a parts mounting work position and discharging the same to the multiple transfers when the mounting of the parts is finished.
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申请公布号 |
US2002062553(A1) |
申请公布日期 |
2002.05.30 |
申请号 |
US20010987421 |
申请日期 |
2001.11.14 |
申请人 |
MIRAE CORPORATION |
发明人 |
HWANG JI HYUN;KIM DO HYUN |
分类号 |
B23P19/00;H05K13/00;H05K13/02;H05K13/04;(IPC1-7):H05K3/30 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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