发明名称 Surface mounting device and method thereof
摘要 A surface mounting device comprising: multiple transfers being moved in the X and Y axis directions by an X-Y gantry installed on a base frame and supplying a printed circuit board(PCB) for mounting parts or loading the discharged PCB by a head unit for sucking parts supplied from a parts supply unit and mounting the sucked parts on the PCB and multiple conveyers installed to be moved horizontally in a predetermined direction at a predetermined position on the base frame for carrying the PCB supplied from the multiple transfers to a parts mounting work position and discharging the same to the multiple transfers when the mounting of the parts is finished.
申请公布号 US2002062553(A1) 申请公布日期 2002.05.30
申请号 US20010987421 申请日期 2001.11.14
申请人 MIRAE CORPORATION 发明人 HWANG JI HYUN;KIM DO HYUN
分类号 B23P19/00;H05K13/00;H05K13/02;H05K13/04;(IPC1-7):H05K3/30 主分类号 B23P19/00
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