| 摘要 |
The present invention provides a film carrier semiconductor device comprising: an insulative base film; inner leads provided on a first surface of the insulative base film; a signal interconnection pattern provided on the first surface of the insulative base film; a ground plane provided on a second surface of the insulative base film; a conductive supporting plate fixed by a conductor to the first surface of the insulative base film, wherein the conductive supporting plate serves as a power voltage plane.
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