发明名称 SURFACE MOUNTING APPARATUS AND METHOD THEREOF
摘要 PURPOSE: A surface mounting apparatus is provided to simultaneously mount parts on two or more PCBs(printed circuit boards) to improve productivity. CONSTITUTION: A surface mounting apparatus comprises a first transfer(20), a first conveyer(30), a second conveyer(40), a first and a second linear power transmission devices(35,45), and a second transfer(50). The first transfer(20) moves in X-Y plane for transferring stored PCBs. The first conveyer(30) positions the PCBs from the first transfer(20) at part mount locations and ejects the PCBs after mounting. The second conveyer(40) positions the PCBs received selectively from the first transfer(20) and the first conveyer(30) at part mount locations. The first and the second linear power transmission devices(35,45) generate driving force for moving the first and the second conveyers(30,40). The second transfer(50) moves in X-Y plane for ejecting the PCBs received selectively from the first and the second conveyers(30,40).
申请公布号 KR20020040415(A) 申请公布日期 2002.05.30
申请号 KR20000070454 申请日期 2000.11.24
申请人 MIRAE CORPORATION 发明人 HWANG, JI HYEON;KIM, DO HYEON
分类号 H05K13/00;(IPC1-7):H05K13/00 主分类号 H05K13/00
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