发明名称 |
Adhesives and electric devices |
摘要 |
An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.
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申请公布号 |
US2002062918(A1) |
申请公布日期 |
2002.05.30 |
申请号 |
US20010971040 |
申请日期 |
2001.10.05 |
申请人 |
SONY CHEMICALS CORP. |
发明人 |
TAKEICHI MOTOHIDE;KONISHI MISAO;SHINOZAKI JUNJI;AKUTSU YASUSHI |
分类号 |
C09J7/00;C08G59/18;C09J5/06;C09J9/02;C09J163/00;C09J201/00;H01L21/56;H01L21/60;H01L23/29;H01L23/31;(IPC1-7):B32B31/00;C09J5/00 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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