| 摘要 |
PURPOSE: A process for polishing the surface of a silicon wafer is provided to lead to a reduced number of surface defects after the application of an epitaxial coating to this silicon wafer and therefore to cost savings in the component fabrication process. CONSTITUTION: The surface-polishing process has a mixture of polishing abrasive and alcohol being added to both polishing plates. This leads to a significant reduction in localized light scatterers, in particular of stacking faults, on an epitaxial coating applied to this surface, compared to processes according to the prior art.
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