Wafer diameter/sectional shape measuring machine,申请号EP19950100988-传众专利搜索

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发明名称	Wafer diameter/sectional shape measuring machine
摘要
申请公布号	EP0665576(B1)	申请公布日期	2002.05.29
申请号	EP19950100988	申请日期	1995.01.25
申请人	TOKYO SEIMITSU CO.,LTD.	发明人	KAGAMIDA, TAKESHI
分类号	G01B11/24;G01B11/08;G06T1/00;H01L21/00;H01L21/66;H01L21/677;(IPC1-7):H01L21/00;B24B9/06	主分类号	G01B11/24
代理机构		代理人
主权项
地址

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